ASX · NYSE
ASE Technology Holding Co., Ltd.
$38.76 +1.03 (+2.74%)
Company overview
ASE Technology Holding Co., Ltd. provides semiconductor packaging, testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA) and chip scale packages (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions; and copper and silver wire bonding solutions. It also provides advanced packages such as flip chip BGA, heat-spreader FCBGA, flip-chip CSP, hybrid FCCSP, flip chip package in package and package on package (POP), advanced single-sided substrate, high-bandwidth POP, fan-out wafer-level packaging, SESUB, and 2.5D silicon interposer.
- Sector
- Technology
- Industry
- Semiconductors
- Exchange
- NYSE
- Market cap
- $85.2B
- Employees
- 96,436
- Headquarters
- Kaohsiung
- Website
- aseglobal.com
- CEO
- Hung-Pen Chang
- Listed
- October 2, 2000
- P/E
- 1.79
- Dividend yield
- 0.93%
Company financials
- Revenue
- $666B
- Gross profit
- $122B
- Operating income
- $58.7B
- EBITDA
- $130B
- Net income
- $47.1B
- EPS
- $21.62
- Total assets
- $957B
- Total debt
- $257B
- Gross margin
- 18.32%
- Net margin
- 7.07%
- Earnings yield
- 55.78%
No annual product segmentation.
Showing FY 2025
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O40.06H40.22L37.28C37.74-4.67 (-11.01%)Vol13.63M